24 Infos zu Lars Titerle

1 Aktuelle Nachrichten

1 Profile in Sozialen Netzwerken

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1 Hobbys & Interessen

Archived* (*May have duplicates - we are upgrading our archive.) Method and device for applying a solder to a substrate ### The bibliographic ...

1 Business-Profile

PAC TECH - PACKAGING TECHNOLOGIES GMBH, Berlin, DE

2 Bücher zum Namen

... Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, 'Laser solder attach for optoelectronics packages', www..pactech.de. Paul P.E. Wang, Steven Perng and ...

Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has...

3 Dokumente

von A Strandjord · Zitiert von: 3 — Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, “High Speed Laser Solder Jetting Technology for. Optoelectronics and MEMS Packaging Seiten

von 李福泉 · · Zitiert von: 9 — [9] Elke Zakel ,Lars Titerle ,Thomas Oppert et al. Laser solder ball application for optoelectronics and MEMS packaging. [ C] . OPTATEC , [10] Grerald ... von 李福泉 · · Zitiert von: 9 — [9] Elke Zakel ,Lars Titerle ,Thomas Oppert et al. Laser solder ball application for optoelectronics and MEMS packaging. [ C] . OPTATEC , [10] Grerald ...

— Ghassem Azdasht, Lars Titerle. US (A1) Appl. no , Int. Cl. B23K United States Patent and Trademark — Ghassem Azdasht, Lars Titerle. US (A1) Appl. no , Int. Cl. B23K United States Patent and Trademark ...

6 Wissenschaftliche Publikationen

Inventors: Elke Zakel, Paul Kasulke, Oliver Uebel, Lars Titerle. TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANGEMENT. Publication number ... Inventors: Elke Zakel, Paul Kasulke, Oliver Uebel, Lars Titerle. TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANGEMENT. Publication number ...

Inventors: Elke Zakel, Paul Kasulke, Oliver Uebel, Lars Titerle. DESOLDERING DEVICE AND ATTACHMENT THEREOF. Publication number: Abstract: A ... Inventors: Elke Zakel, Paul Kasulke, Oliver Uebel, Lars Titerle. DESOLDERING DEVICE AND ATTACHMENT THEREOF. Publication number: Abstract: A ...

Date of Patent: Oct 18, Patent Publication Number: Assignee: Pac Tec-Packaging Technologies GmbH (Nauen (bei Berlin)) Inventors: Elke Zakel (Falkenssee), Paul Kasulke (Berlin), Oliver Uebel (Berlin), Lars Titerle (Berlin) Primary Examiner: Colleen P. Cooke Attorney: Dougherty, Clements & Hofer

Inventors: Elke Zakel (Falkensee), Paul Kasulke (Berlin), Oliver Uebel (Berlin), Lars Titerle (Berlin) Primary Examiner: Brian K. Talbot › patent

1 Allgemeine Veröffentlichungen

— Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G.Blankenhorn, “High Speed Laser Solder JettingTechnology for Optoelectronics and ...

7 Webfunde aus dem Netz

Lars Titerle · Thomas Oppert; Ronald G Blankenhorn. The packaging of optoelectronics and MEMS devices is placing ...

Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, 'Laser solder attach for optoelectronics packages', www..pactech.de. Paul P.E. Wang, Steven ... Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, 'Laser solder attach for optoelectronics packages', www..pactech.de. Paul P.E. Wang, Steven ...

... Proceedings of the Chip Scale International, San Jose CA, September , [4] Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, ... › amp ›

1 Laser Solder Attach for Optoelectronics Packages Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn* Pac Tech Packaging Technologies GmbH Am ... ›

1 Laser Solder Attach for Optoelectronics Packages Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn* Pac Tech Packaging Technologies GmbH ...