73 Infos zu Moritz-andreas Meyer
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- GLOBALFOUNDRIES
- Ehrenfried Zschech
- Eckhard Langer
2 Aktuelle Nachrichten
BMBF fördert Forschung mit 2,5 Mio. EuroBrandenburgische Technische Universität Cottbus-SenftenbergMoritz Andreas Meyer: „Effects of advanced process approaches on electromigration degradation of Cu on-chip inter- connects“. Dr.-Ing. Andreas Vedral ... Moritz Andreas Meyer: „Effects of advanced process approaches on electromigration degradation of Cu on-chip inter- connects“. Dr.-Ing. Andreas Vedral ...
Zeitung der Brandenburgischen Technischen Universität Cottbusdocplayer.org › Zeitung-der-brandenburgischen-technischen-un...Moritz Andreas Meyer: Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects Dr.-Ing. Andreas Vedral: Digitale ...
7 Profile in Sozialen Netzwerken
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LinkedIn: Moritz Andreas Meyer | LinkedInWerden Sie Mitglied von LinkedIn und erhalten Sie Zugriff auf das vollständige Profil von Moritz Andreas Meyer. Völlig kostenlos! Als Mitglied von LinkedIn ...
1 Hobbys & Interessen
Globalfoundries Inc patent inventors (2011)Martin Gerhardt · Martin Trentzsch · Marwan H. Khater · Matthew S. Ryskoski · Matthias Kessler · Matthias Lehr · Michael Grillberger · Michael Hargrove · Michael J. Hargrove · Michael Su · Moritz-andreas Meyer · Norbert Schroeder · Patrick Press · Paul R. Besser · Peter Javorka · Qiang Chen · Rainer Giedigkeit · Ralf Richter.
2 Business-Profile
patentbuddy: Moritz-Andreas MeyerGLOBALFOUNDRIES INC., Dresden, DE
patentbuddy: Moritz Andreas MeyerADVANCED MICRO DEVICES, INC., Dresden, DE
1 Infos zur Ausbildung
Lehrstuhl Angewandte Physik/Sensorik | LehreMoritz Andreas Meyer, AMD Dresden: : Röntgenmikroskopie in der Halbleiterindustrie - Potentielle Anwendungen Dr. Ehrenfried Zschech, …
13 Bücher zum Namen
Mathias Herrmann | Fraunhofer Society | 184 PublicationsAI Chat for scientific PDFs | SciSpaceMoritz-Andreas Meyer 1, Mathias Herrmann, Eckhard Langer 1, Ehrenfried Zschech 1• Institutions (1). Advanced Micro Devices Sep Microelectronic ... Moritz-Andreas Meyer 1, Mathias Herrmann, Eckhard Langer 1, Ehrenfried Zschech 1• Institutions (1). Advanced Micro Devices Sep Microelectronic ...
Effects of Advanced Process Approaches on Electromigration ...Google BooksTitle, Effects of Advanced Process Approaches on Electromigration Degradation of Cu On-chip Interconnects. Author, Moritz Andreas Meyer. Published, Title, Effects of Advanced Process Approaches on Electromigration Degradation of Cu On-chip Interconnects. Author, Moritz Andreas Meyer. Published,
ISTFA 2013: Proceedings from the 39th International ...google.com... Sample Preparation Strategies for Fast and Effective Failure Analysis of. ISTFA 2013: Conference Proceedings from ...
Materials for Information Technology: Devices, Interconnects ...google.com... T. Mikolajick Infineon Technologies Dresden Flash Technology Predevelopment IFD MDC TD FL2 D
9 Dokumente
Potential and Limits of Texture Measurement Techniques ...National Institute of Standards and Technology (.gov)von H Geisler · Zitiert von: 2 — Moritz-Andreas Meyer, Ehrenfried Zschech. AMD Saxony LLC & Co. KG, Dresden, Germany. Page ICCM, March , 2003, Austin, Texas. Holm Geisler. 2. von H Geisler · Zitiert von: 2 — Moritz-Andreas Meyer, Ehrenfried Zschech. AMD Saxony LLC & Co. KG, Dresden, Germany. Page ICCM, March , 2003, Austin, Texas. Holm Geisler. 2.
Center for Complex Analysis - Globalfoundires - Academia.eduAcademia.edu... Moritz Andreas Meyer, Dmytro Chumakov ... Save to Library. by Hans-Juergen Engelmann; •. Process Control and Physical Failure Analysis for Sub-100NM CU/Low-K Moritz Andreas Meyer, Dmytro Chumakov ... Save to Library. by Hans-Juergen Engelmann; •. Process Control and Physical Failure Analysis for Sub-100NM CU/Low-K ...
New Microstructure-Related EM Degradation and Failure ...AIP.ORGvon MA Meyer · · Zitiert von: 14 — Moritz Andreas Meyer , Ehrenfried Zschech. AMD Saxony LLC & Co KG, Wilschdorfer , D Dresden, Germany. * . von MA Meyer · · Zitiert von: 14 — Moritz Andreas Meyer , Ehrenfried Zschech. AMD Saxony LLC & Co KG, Wilschdorfer , D Dresden, Germany. * .
Study of electromigration-induced voiding mechanisms in CU ...DR-NTU— I am grateful to Ehrenfried Zschech and Moritz Andreas Meyer for providing an opportunity to work on the in-situ SEM system and support at — I am grateful to Ehrenfried Zschech and Moritz Andreas Meyer for providing an opportunity to work on the in-situ SEM system and support at ...
2 Wissenschaftliche Publikationen
Microstructure effect on EM-induced copper interconnect ...ScienceDirect.comvon E Zschech · · Zitiert von: 21 — The authors thank Moritz Andreas Meyer, AMD Saxony Dresden, Germany, and Gerd Schneider, BESSY Berlin, Germany, for performing the in situ scanning electron ... von E Zschech · · Zitiert von: 21 — The authors thank Moritz Andreas Meyer, AMD Saxony Dresden, Germany, and Gerd Schneider, BESSY Berlin, Germany, for performing the in situ scanning electron ...
abgeschlossene - Fachgebiet Angewandte Physik/Sensorik - BTU...Moritz Andreas Meyer (AMD Dresden) „Effects of BEOL processing and copper microstructure on interconnect degration" (2007) online (OPUS)
6 Allgemeine Veröffentlichungen
Effects of advanced process approaches on ...COREvon MA Meyer · · Zitiert von: 7 — Moritz Andreas Meyer. July Page 2. Page 3. Effects of advanced process approaches on electromigration degradation of. Cu on-chip interconnects. Von der ... von MA Meyer · · Zitiert von: 7 — Moritz Andreas Meyer. July Page 2. Page 3. Effects of advanced process approaches on electromigration degradation of. Cu on-chip interconnects. Von der ...
Jatropha oil production as biofuel for Shea butter ...YouScribe... Moritz Andreas Meyer. Info · Influence of Ectomycorrhiza Moritz Andreas Meyer. Info · Influence of Ectomycorrhiza ...
Geometry and Microstructure Effect on EM-Induced Copper ...ResearchGate— Moritz Andreas Meyer · Moritz Andreas Meyer. This person is not on ResearchGate, or hasn't claimed this research yet — Moritz Andreas Meyer · Moritz Andreas Meyer. This person is not on ResearchGate, or hasn't claimed this research yet.
Effects of advanced process approaches on electromigration...Lisez Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects [Elektronische Ressource] / vorgelegt von Moritz...
29 Webfunde aus dem Netz
Methods and devices for the suppression of copper hillock ...Google Patents... Moritz-Andreas Meyer Technique for forming embedded metal lines having increased resistance against stress-induced material transport. US A1 * Moritz-Andreas Meyer Technique for forming embedded metal lines having increased resistance against stress-induced material transport. US A1 *
CN A - 于扩散阻障层中检测缺陷的方法Google PatentsUS A1 * Moritz Andreas Meyer Method of testing an integrity of a material layer in a semiconductor structure. US A US A1 * Moritz Andreas Meyer Method of testing an integrity of a material layer in a semiconductor structure. US A1 ...
Moritz Andreas Meyer's research works | Advanced Micro ...ResearchGateMoritz Andreas Meyer's 13 research works with 229 citations and 276 reads, including: Technique for forming metal lines in a semiconductor by adapting the ... Moritz Andreas Meyer's 13 research works with 229 citations and 276 reads, including: Technique for forming metal lines in a semiconductor by adapting the ...
Fortschritte in der MetallographieTIB – Leibniz-Informationszentrum Technik und NaturwissenschaftenHans-Jürgen Engelmann, Eckhard Langer, Moritz-Andreas Meyer, Pavel Potapov, Dirk Utess, Kornelia Dittmar, Christoph Klein · 13 · Intermetallische Titanaluminide ... Hans-Jürgen Engelmann, Eckhard Langer, Moritz-Andreas Meyer, Pavel Potapov, Dirk Utess, Kornelia Dittmar, Christoph Klein · 13 · Intermetallische Titanaluminide ...
SEM in-situ Study of Electromigaration Induced Degradation ...ASM Digital LibraryMoritz Andreas Meyer;. Moritz Andreas Meyer. AMD Saxony Manufacturing GmbH Dresden. ,. Germany. Search for other works by this author on: This Site · Google ... Moritz Andreas Meyer;. Moritz Andreas Meyer. AMD Saxony Manufacturing GmbH Dresden. ,. Germany. Search for other works by this author on: This Site · Google ...
专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB知嘟嘟Moritz-Andreas Meyer , Hans-Juergen Engelmann , Ehrenfried Zschech , Peter Huebler; IPC分类号： H01L ; CPC分类号： H01L , H01L , H01L Moritz-Andreas Meyer , Hans-Juergen Engelmann , Ehrenfried Zschech , Peter Huebler; IPC分类号： H01L ; CPC分类号： H01L , H01L , H01L
Application to Cu Interconnects in Top-View and Cross SectionSemantic Scholar... Moritz Andreas Meyer and Inka Zienert and Ehrenfried Zschech}, year={2005}, url={https://api.semanticscholar.org/CorpusID: } }. M. Meyer, I. Zienert Moritz Andreas Meyer and Inka Zienert and Ehrenfried Zschech}, year={2005}, url={https://api.semanticscholar.org/CorpusID: } }. M. Meyer, I. Zienert ...
Effects of advanced process approaches on electromigration ...Kooperativer Bibliotheksverbund Berlin-Brandenburg (KOBV)von MA Meyer · · Zitiert von: 7 — Moritz Andreas Meyer. URN: urn:nbn:de:kobv:co1-opus Referee / Advisor: Prof. Dr. Dieter Schmeißer. Document Type: Doctoral thesis. von MA Meyer · · Zitiert von: 7 — Moritz Andreas Meyer. URN: urn:nbn:de:kobv:co1-opus Referee / Advisor: Prof. Dr. Dieter Schmeißer. Document Type: Doctoral thesis.
IRPS Management & Technical CommitteesIRPS - International Reliability Physics SymposiumMoritz Andreas Meyer, GlobalFoundries. Hyuncheol (Caleb) Shin, Intel. Back to Top. GaN Power Devices. Chair Kaustubh Joshi, Intel. Vice-Chair Srabanti Chowdhury ... Moritz Andreas Meyer, GlobalFoundries. Hyuncheol (Caleb) Shin, Intel. Back to Top. GaN Power Devices. Chair Kaustubh Joshi, Intel. Vice-Chair Srabanti Chowdhury ...
In situ SEM observation of electromigrationGlobalsino.comGusak, Moritz Andreas Meyer, and Ehrenfried Zschech, In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect ... Gusak, Moritz Andreas Meyer, and Ehrenfried Zschech, In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect ...
Integration Aspects of CoWP Capping Layers for ...Semantic ScholarSchmidt Ott and Michael Friedemann and Frank Feustel and Moritz Andreas Meyer and Pascal Limbecker}, journal={2008 International Interconnect Technology ... Schmidt Ott and Michael Friedemann and Frank Feustel and Moritz Andreas Meyer and Pascal Limbecker}, journal={2008 International Interconnect Technology ...
Poster SessionIMC th International Microscopy Congress... Moritz Andreas Meyer. # Modifying the Electron Beam with a Programmable Phase Plate for Ptychographic Reconstructions. Stephanie Ribet, Steven Zeltmann Moritz Andreas Meyer. # Modifying the Electron Beam with a Programmable Phase Plate for Ptychographic Reconstructions. Stephanie Ribet, Steven Zeltmann ...
Welcome to Electronic Thin Film Lab at UCLA!UCLA Samueli School of Engineering... Moritz Andreas Meyer, Ehrenfried Zschech, "In-situ observation of electromigration induced void migration in dual-damascene Cu interconnect structures Moritz Andreas Meyer, Ehrenfried Zschech, "In-situ observation of electromigration induced void migration in dual-damascene Cu interconnect structures ...
Moritz Andreas Meyer | LinkedInView Moritz Andreas Meyer's professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Moritz Andreas Meyer ...
US B1 - Method and apparatus for run-to-run control of...A method and an apparatus for controlling a deposition process in a manufacturing process. A process recipe setting step is performed. A process run of...
US A1 - Stripping agent composition and method of ...patents.google.com › patentUS A1 (en) *, Moritz Andreas Meyer, Method of testing an integrity of a material layer in a semiconductor structure.
US A - Method for implanting semiconductor conductive layerswww.google.com.gi › patentsUS A1 * Moritz Andreas Meyer technique for forming metal lines in a semiconductor by adapting the temperature dependence of ...
Chair Applied Physics and Sensors | PublicationsMoritz Andreas Meyer (AMD Dresden): „Effects of BEOL processing and copper microstructure on interconnect degration" (2007) Mohammad Hossein Tavakoli (IKZ ...
Electromigration degradation mechanism analysis of SnAgCu ...oa.mg › work › irpsFailures in copper interconnects-localization, analysis and degradation mechanisms. Ehrenfried Zschech, Eckhard Langer, Moritz-Andreas Meyer.
Fortschritte in der Metallographie - Technische Informationsbibliothekgoobi.tib.eu › viewer › imageHans-Jürgen Engelmann, Eckhard Langer, Moritz-Andreas Meyer, Pavel Potapov, Dirk Utess, Kornelia Dittmar, Christoph Klein.
Bedeutung zum Vornamen Moritz
Männlicher Vorname (Deutsch): Moritz; der aus Mauretanien Stammende, der Mohr; Lateinisch (Römischer Beiname); maurus = dunkelhäutig; ursprünglich ein römischer Beiname 'Mauricius' 'der aus Mauretanien Stammende, der Mohr'; im Mittelalter verbreitet durch die Verehrung des hl. Mauritius, des Anführer der Thebäischen Legion in der Schweiz (4. Jh.)
Bedeutung zum Vornamen Andreas
Männlicher Vorname (Deutsch): Andreas; der Männliche, der Tapfere; Altgriechisch (Neues Testament); andreios = mannhaft, tapfer; bekannt durch den hl. Andreas, Apostel, Bruder von PetrusMännlicher Vorname (Altgriechisch, Lateinisch): Andreas; der Männliche, der Tapfere; Altgriechisch (Neues Testament); andreios = mannhaft, tapfer; bekannt durch den hl. Andreas, Apostel, Bruder von Petrus Andreas bedeutet auf Altgriechisch "der Tapfere".
Bedeutung zum Nachnamen Meyer
- mittelhochdeutscher Berufsname "meiger" -> " Meier, Oberbauer,
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