10 Infos zu Robert Hammedinger

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Recent bibliographic sampling of Robert Hammedinger patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title): ...

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This invention is for holding components made of a ferromagnetic material parallel to a component axis for electroplating the component. The component...

When manufacturing a semiconductor device by mounting a semiconductor chip 2 on a substrate 1 with a flip-chip method, projections 9 are formed...

The invention relates to a method of soldering a conducting body to a substrate using an alloy chosen from either a tin-silver alloy or a...

Patent application title: WELDABLE CONTACT AND METHOD FOR THE PRODUCTION THEREOF. Inventors: Robert Hammedinger (Poing, ...

Die Erfindung betrifft ein Bauelement, einen in Flip-Chip-Technik auf ein Trägersubstrat aufgebrachten Bauelementchip und ein Verfahren zur Herstellung.Die...

US A1 * Robert Hammedinger Weldable contact and method for the production thereof. US A1 *

The invention relates to a weldable contact for an electrical component, comprising a pad metallisation and a UBM metallisation applied on top of the...

A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part...