31 Infos zu Rudolf Kutscherauer

2 Aktuelle Nachrichten

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2 Dirk Schweitzer, Heinz Pape, Liu Chen, Rudolf Kutscherauer, and Martin Walder: "Transient Dual Interface Measurement - A New JEDEC Standard for the ...

1 Hobbys & Interessen

2 Dirk Schweitzer, Heinz Pape, Liu Chen, Rudolf Kutscherauer, and Martin Walder: “Transient Dual Interface Measurement – A New JEDEC ...

1 Business-Profile

SIEMENS AKTIENGESELLSCHAFT, Forstern, DE

1 Bücher zum Namen

5,087,479 METHOD AND APPARATUS FOR ENVELOPING AN ELECTRONIC COMPONENT Patrick McManus, Munich, and Rudolf Kutscherauer, Forstem, ...

1 Dokumente

The junction-to-case thermal resistance Rth-JC is an important thermal characteristic for power semiconductor devices. Its value is often one of the main criter

6 Wissenschaftliche Publikationen

List of computer science publications by Heinz Pape

List of computer science publications by Rudolf Kutscherauer

Heinz Pape, Dirk Schweitzer, Liu Chen, Rudolf Kutscherauer, Martin Walder: Development of a standard for transient measurement of ...

Bibliographic content of Microelectronics Reliability, Volume 52

14 Webfunde aus dem Netz

Heinz Pape, Kay Schiller and Rudolf Kutscherauer. Infineon Technologies AG. Corp. Assembly & TestD Muenchen, Germany. Abstract .

Development of a standard for transient measurement of junction-to-case thermal resistance. Heinz Pape, Dirk Schweitzer, Liu Chen, Rudolf Kutscherauer, ...

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Rudolf Kutscherauer (2) Mathias Kutscherauer (2) Matthias Kutscherauer (2) Andreas Kutscherauer (2) Michael Kutscheraue ...Vornamen Anton Kutscherauer (5)

Martin Kutscherauer (2) Rudolf Kutscherauer (2) Mathias Kutscherauer (2) Matthias Kutscherauer (2) Andreas Kutscherauer (2) Michael Kutscher ...Given names

Heinz Pape, Kay Schille, Rudolf Kutscherauer, Infineon Technologies AG, Germany. Wafer Scale Power Transistor Package: Electro-Thermal Modeling and

How to evaluate transient dual interface measurements of the Rth-JC of power semiconductor packages. Dirk Schweitzer, Heinz Pape, Rudolf Kutscherauer, ...

In 24th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pages , [3] Dirk Schweitzer, Heinz Pape, Rudolf Kutscherauer, and ...

10h30, 30mn, Keynote: Board Via Effect on Thermal Performance of a Leadless Package, Heinz Pape, Kay Schille, Rudolf Kutscherauer, Infineon Technologies ...

2 Dirk Schweitzer, Heinz Pape, Liu Chen, Rudolf Kutscherauer, and Martin Walder: “Transient Dual Interface Measurement – A New JEDEC ...

$ ©2011 IEEE th IEEE SEMI-THERM Symposium Transient Dual Interface Measurement – A New JEDEC Standard for the Measurement of...

... Heinz Pape, Rudolf Kutscherauer and Martin Walder...Infineon Technologies, Germany Indium Solder as a Thermal Interface Material Using ...

1 Budapesti Műszaki és Gazdaságtudományi Egyetem Villamosmérnöki és Informatikai Kar Lineáris elosztott...

... Dirk Schweitzer, Liu Chen, Rudolf Kutscherauer, Martin Walder. Development of a standard for transient measurement of junction-to-case thermal resistance.